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High power 250W CW conductively cooled diode laser arrays with low-smile 会议论文
San Francisco, CA, United states, 2020-02-03
作者:  Zhang, Hongyou;  Zhu, Pengfei;  Fu, Tuanwei;  Li, Meiqin;  Lv, Ning
收藏  |  浏览/下载：11/0  |  提交时间：2020/05/18
Three-Dimensional Steady-State Thermal Model of a High Power Diode Laser 会议论文
San Francisco, CA, 2019-02-04
作者:  Wu, Di-Hai;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载：21/0  |  提交时间：2019/06/28
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling
收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning
收藏  |  浏览/下载：15/0  |  提交时间：2016/10/18
a bisection-function technique to characterize heat transport in high-power gan-based light-emitting-diodes package 会议论文
12th International Conference on Numerical Simulation of Optoelectronic Devices, NUSOD 2012, Shanghai, China, August 28, 2012 - August 31, 2012
Cheng Liwen; Sheng Yang; Chang Shengxia; Hu Weida; Lu Wei
收藏  |  浏览/下载：12/0  |  提交时间：2013/09/22
Thermal modeling and analysis of high power semiconductor laser arrays 会议论文
2012 13th international conference on electronic packaging technology and high density packaging, icept-hdp 2012, guilin, china, august 13, 2012 - august 16, 2012
作者:  Pu Zhang;  Zhiqiang Nie
收藏  |  浏览/下载：8/0  |  提交时间：2013/06/26
Small-signal and large-signal performance test of high-speed optoelectronics devices 会议论文
conference on semiconductor and organic optoelectronic materials and devices, beijing, peoples r china, nov 09-11, 2004
Zhu NH; Chen C; Sun JW; Pun EYB; Chung PS
收藏  |  浏览/下载：121/40  |  提交时间：2010/03/29
Study on optical parts of MOEMS optical switch with low insertion loss (EI CONFERENCE) 会议论文
MEMS/MOEMS Technologies and Applications II, November 10, 2004 - November 12, 2004, Beijing, China
Ming A.; Liang J.; Lan W.; Dong W.; Yao J.; Wang W.; Le Z.; Chen W.; Wang L.
收藏  |  浏览/下载：22/0  |  提交时间：2013/03/25
We study insertion losses of optical switch when the laser beam is propagating during the free space between two single mode fibers (SMFs) and the related assemblage challenges  Then a new packaging structure is developed for the hybrid-integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount to improve alignment accuracy. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment  thus reducing the packaging cost. The silicon submount has a central recess to place the MOEMS chip in  sixteen V-grooves for optical fibers  and micropits for micro ball lenses  all bulk micromachined at the same time by a single anisotropic wet etching step. A corner compensation technique is employed to prevent erosion of the convex corners  where different geometries meet. Through this assembling method  the fiber  micro ball lens can be aligned preciously thus reduced lateral and angular misalignment between them. Then total insertion losses can be decreased.  

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