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Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 会议论文
作者:  Wen, Junxia;  Che, Hongyan;  Cao, Rui;  Dong, Hao;  Ye, Youxiong
收藏  |  浏览/下载：2/0  |  提交时间：2020/12/18
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载：10/0  |  提交时间：2020/05/18
A study on the oxygen plasma treatment on the peel adhesion strength and solder wettability of SnBi58 based anisotropic conductive films 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Zhang, Shuye;  Huang, Mingliang;  Wu, Yang;  Yang, Ming;  Lin, Tiesong
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Electromigration-induced -Sn grain rotation in lead-free flip chip solder bumps 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Kuang, Jiameng M.;  Sun, Hongyu Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Improved Thermal Conductive Property of Pine Needle Derived Carbon for Thermal Management Applications 会议论文
20th International Conference on Electronic Materials and Packaging, EMAP 2018, Clear Water Bay, Hong kong, 2018-12-17
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收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03
Control Network Reconstruction of Nickel Plates Packaging System 会议论文
Dalian, PEOPLES R CHINA, DEC 21-22, 2018
作者:  Zhao Zhengtian;  Rui Zhiyuan;  Duan Xiaoyan
收藏  |  浏览/下载：0/0  |  提交时间：2020/11/09
Control Network Reconstruction of Nickel Plates Packaging System 会议论文
作者:  Zhao Zhengtian;  Rui Zhiyuan;  Duan Xiaoyan
收藏  |  浏览/下载：0/0  |  提交时间：2019/11/15
A novel graphene oxide millisphere / epoxy resin composite with Enhanced Thermal Conductivit 会议论文
上海, 2018
作者:  Chen Li;  Xiaoliang Zeng;  Deliang Zhu;  Rong Sun;  Jianbin Xu
收藏  |  浏览/下载：27/0  |  提交时间：2019/01/31
Preparation and characterization of the double-side adhesive tape with reactive properties and high thermal conductivity for electronic packaging 会议论文
上海, 2018
作者:  Chang Hao;  Zhang Baotan;  Sun Rong
收藏  |  浏览/下载：30/0  |  提交时间：2019/01/31

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