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Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point 会议论文
作者:  Zhao ZL;  Mo DF;  Wu JR;  Jiang MD;  Zhang JL
收藏  |  浏览/下载:30/0  |  提交时间:2018/11/20
Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Qianqian Liu
收藏  |  浏览/下载:32/0  |  提交时间:2017/01/15
Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:  Yankang Han;  Baotan Zhang;  Pengli Zhu;  Shulei Huang;  Rong Sun
收藏  |  浏览/下载:24/0  |  提交时间:2017/01/15
Grain orientation dependence of extended planar dislocation boundaries in cold-rolled polycrystalline aluminium 会议论文
PROGRESSES IN FRACTURE AND STRENGTH OF MATERIALS AND STRUCTURES, 1-4, Asian Pacific Conference for Fracture and Strength (APCFS'06), Sanya, PEOPLES R CHINA, Web of Science
Lin, Fengxiang; Godfrey, Andrew; Liu, Qing
收藏  |  浏览/下载:3/0
Test study on behavior of interface between structure and coarse grained 会议论文
Proceedings of the 16th International Conference on Soil Mechanics and Geotechnical Engineering, Vols 1-5 - GEOTECHNOLOGY IN HARMONY WITH THE GLOBAL ENVIRONMENT, 16th International Conference on Soil Mechanics and Geotechnical Engineering, Osaka, JAPAN, Web of Science
Zhang, Ga; Zhang, Jian-Min
收藏  |  浏览/下载:1/0


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