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| The interpenetration polymer network in a cement paste–waterborne epoxy system 会议论文
作者: Pang, Bo; Jia, Yantao; Pang, Sze Dai; Zhang, Yunsheng; Du, Hongjian
  收藏 | 浏览/下载：11/0 | 提交时间：2020/12/18
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| High thermal conductive epoxy resin composites filled with Al2O3@BN core-shell hybrid particles 会议论文
上海, 2018
作者: Huayuan Li; Yuan Gao; Pengli Zhu; Gang Li; Rong Sun
收藏 | 浏览/下载：24/0 | 提交时间：2019/01/31 |
| Influence of the morphology of alumina filler on electrical and thermal properties of epoxy resin composites 会议论文
作者: Ma, Jiawei; Gao, Naikui; Ren, Tengyue; Pan, Zehua; Jin, Haiyun
收藏 | 浏览/下载：5/0 | 提交时间：2019/11/19
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| Fabrication of embedded piezoelectric sensors and its application in traffic engineering 会议论文
Singapore, Singapore, September 1, 2017 - September 3, 2017
作者: Zhang, Xingjun; Song, Shanglin; Yao, Ming Jie
收藏 | 浏览/下载：1/0 | 提交时间：2020/11/15
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| Effect of Adding Multiwall Carbon Nanotubes on the Mechanical Properties of Carbon Fiber Based Polymer Composites 会议论文
3RD INTERNATIONAL CONFERENCE ON GREEN MATERIALS AND ENVIRONMENTAL ENGINEERING (GMEE), 2017-01-01
作者: Fouda, Hany; Guo, Lin; Ghith, Khalid
收藏 | 浏览/下载：6/0 | 提交时间：2019/12/30
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| 3D graphene foam and carbon fibers reinforced epoxy resin composites with enhanced thermal conductivity 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者: Sheng-Yun Huang; Yaqiang Ji; Haoran Wen; Kai Zhang; Matthew M.F. Yuen
收藏 | 浏览/下载：22/0 | 提交时间：2017/01/15 |
| Enhanced Thermal Conductivity and Mechanical Properties of Epoxy Resin-Alumina-Silicon Carbide Fibers Three-Phase Composites 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Xiaoliang Zeng; Kun Guo; Shuhui Yu; Rong Sun; Jian-Bin Xu
收藏 | 浏览/下载：17/0 | 提交时间：2017/01/15 |
| Development and Application of Polymer-based Nanocomposite Dielectrics 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Suibin Luo; Shuhui Yu; Rong Sun; Ching-Ping Wong
收藏 | 浏览/下载：18/0 | 提交时间：2017/01/15 |
| Silver flakes filled Interpenetrating Polymer Network (IPN): high performance electrically conductive adhesives for electronic packaging 会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者: Yankang Han; Baotan Zhang; Pengli Zhu; Shulei Huang; Rong Sun
收藏 | 浏览/下载：24/0 | 提交时间：2017/01/15 |
| Fabrication and Characterization of BaTiO3/Al2O3/Epoxy Composites with Tunable Dielectric Permittivity 会议论文
作者: Zhang, Li-Yuan; Xu, Man; Li, Wen-Dong; Liu, Zhe; Zhang, Guan-Jun
收藏 | 浏览/下载：3/0 | 提交时间：2019/12/02
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