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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Colorful PLLA film fabricated by solution-cast process in humid atmosphere 会议论文 JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 11th China-Korea Symposium on Thin Film Materials, Chengdu, PEOPLES R CHINA, Web of Science, INSPEC Meng, B; Dong, HY; Cui, FZ; Cai, Q 收藏  |  浏览/下载：4/0 Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/05/10 Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/05/10 Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/05/10 Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10