CORC

在结果中检索

CORC

浏览/检索结果: 共22条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Effect of intermetallic compound thickness on tensile behavior of Cu/Sn/Cu micro interconnects 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Kuang, Jiameng;  Yang, Fan;  Huang, Mingliang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/03
Effect of Sn grain orientation on Ni substrate dissolution and intermetallic compounds precipitation in Cu/Sn/Ni interconnect undergoing electromigration 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Liu, XingBo;  Huang, Mingliang
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24
Effect of Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu and Cu/Sn-9Zn/Ni Interconnects 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhou, Q.;  Li, Q.;  Zhou, Y.;  Wang, X. J.;  Huang, M. L.
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/09
Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhao, Jianfei;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：25/0  |  提交时间：2019/12/09
Low Temperature Solid-State-Diffusion Bonding for Fine-Pitch Cu/Sn/Cu Interconnect 会议论文
IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, 2015-05-26
作者:  Cai, Jian;  Wang, Junqiang;  Wang, Qian;  Liu, Ziyu;  Wang, Dejun
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Zhang, Fei;  Yang, Fan;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Huang, Mingliang;  Yang, Fan;  Zhao, Ning;  Liu, Xiaohua;  Wang, Jingyun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/11

©版权所有 ©2017 CSpace - Powered by CSpace