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Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Research of 3D Printing Self-support Technology Based on DFM 会议论文
9th China Academic Conference on Printing and Packaging, 2018, Jinan, China, 2018-11-16
作者:  Li, Meng;  Liu, Linlin;  Wu, Qiumin;  Liu, Xiang;  Ma, Jie
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/20
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
The 68th Electronic Components and Technology Conference
作者:  Huang ML(黄明亮);  Zou L(邹林);  Yin SQ(尹斯奇)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
68th IEEE Electronic Components and Technology Conference, ECTC 2018, San Diego, CA, United states, 2018-05-29
作者:  Huang, M.L.;  Zou, L.;  Yin, S.Q.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Preparation of Hydrogel Material for 3D Bioprinting 会议论文
作者:  Yan, Jia;  Xiao, Yonghao;  Hu, Kun;  Pan, Shun;  Wang, Yulong
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/21
A low-pass filter made up of the cylindrical through-silicon-via 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Fengjuan;  Huang, Jia;  Yu, Ningmei
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/20
Analytical model for 3D IC temperature considering lateral heat conduction 会议论文
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017, Haining, Zhejiang, China, 2017-12-14
作者:  Wang, Fengjuan;  Yu, Ningmei
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/20

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