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浏览/检索结果: 共23条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 ANISOTROPIC SINTERING SHRINKAGE AND GRAIN GROWTH FOR SPHERICAL ALUMINA POWDER COMPACTS ALIGNED IN HIGH MAGNETIC FIELD (CPCI-S收录) 会议论文 CHARACTERIZATION AND CONTROL OF INTERFACES FOR HIGH QUALITY ADVANCED MATERIALS II 作者:  Shui, Anze[1];  Zeng, Lingke[1];  Liu, Yanchun[1];  Makiya, Atsushi[2];  Uematsu, Keizo[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/17 Fabrication, microstructure and mechanical properties of in situ Al2O3 platelets reinforced Ce-TZP composites (EI收录) 会议论文 Key Engineering Materials, Kunming, China, November 11, 2001 - November 15, 2001 作者:  Ye, Jiandong[1];  Wu, Jianqing[1];  Wang, Yingjun[1];  Li, Hongyan[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/19 Alumina  Anisotropy  Bending strength  Fracture toughness  Grain growth  Microstructure  Titanium dioxide   Anisotropic sintering shrinkage and grain growth for spherical alumina powder compacts aligned in high magnetic field (EI收录) 会议论文 Ceramic Transactions, Kurashiki, Japan, September 6, 2006 - September 9, 2006 作者:  Shui, Anze[1];  Zeng, Lingke[1];  Liu, Yanchun[1];  Makiya, Atsushi[2];  Uematsu, Keizo[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/17 Anisotropy  Glass  Grain size and shape  Growth (materials)  Joining  Liquid metals  Magnetic fields  Magnetic materials  Magnetism  Metallic glass  Powders  Quality control  Shrinkage  Sintered alumina  Sintering  Spheres   Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Chengdu, China, August 12, 2014 - August 15, 2014 作者:  Tang, Y.[1,2];  Zhou, B.[3];  Huang, J.H.[1];  Wu, Z.Z.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/12 Bismuth compounds  Copper compounds  Electronics packaging  Grain boundaries  Intermetallics  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Silver  Soldered joints  Tin   Properties of Al films Depend On Substrate Temperature by DC Magnetron Sputter Deposition (CPCI-S收录) 会议论文 NANOTECHNOLOGY AND PRECISION ENGINEERING, PTS 1 AND 2 作者:  Shen, Yi[1];  Yao, Ruohe[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/15 DC magnetron sputter deposition  Substrate temperature  Rresistivity  Grain growth   Abnormal Grain Growth in Cu6Sn5 Grains Formed at Sn-based Solder/Cu Interfaces (CPCI-S收录) 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Yang, Ming[1];  Li, Mingyu[1];  Wu, Jianxin[2];  Xu, Jinhua[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 lead-free solders  abnormal growth  diffusion  IMC   Properties of Al films depend on substrate temperature by DC magnetron sputter deposition (EI收录) 会议论文 Advanced Materials Research, Guilin, China, December 26, 2012 - December 27, 2012 作者:  Shen, Yi[1];  Yao, Ruohe[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Deposition  Grain growth  Metallic films  Nanotechnology  Precision engineering  Sheet resistance  Sputter deposition  Substrates   Microstructure evolution in sintering of alumina-zirconia ceramics simulated by a modified phase field method (EI收录) 会议论文 Materials Science Forum, Sheffield, United kingdom, July 4, 2010 - July 9, 2010 作者:  Wei, Chengyang[1];  Li, Saiyi[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Ceramic materials  Densification  Grain growth  Grain size and shape  Microstructure  Phase transitions  Recrystallization (metallurgy)  Sintered alumina  Zirconia  Zirconium alloys   A Multi-Phase Field Study of the Role of Grain Boundary Diffusion in Growth of Cu6Sn5 Intermetallic Compound during Early Stage of Soldering (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Intermetallic compound  Growth kinetics  Size distribution  Soldering reaction  Multi-phase field simulation   A multi-phase field study of the role of grain boundary diffusion in growth of Cu6Sn5 intermetallic compound during early stage of soldering (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Diffusion  Electronics packaging  Grain boundaries  Grain growth  Growth kinetics  Intermetallics  Kinetics  Morphology  Phase interfaces  Size distribution  Soldering  Soldering alloys