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Microstructure and mechanical performances of plasma-sprayed functionally gradient HA-ZrO2-Bioglass coatings (EI收录) 会议论文
Key Engineering Materials
作者:  Ning, C.Y.[1,2];  Wang, Y.J.[1,2];  Lu, W.W.[3];  Chen, X.F.[1,2];  Wu, G.[2]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/18
Preparation and tensile property of a high-strength, anticorrosion functionally graded 2024/3003 composite (EI收录) 会议论文
Journal of Materials Science
作者:  Li, Yuan-Yuan[1];  Zhang, Wei-Wen[1];  Chen, Wei-Ping[1];  Fei, Jin[1];  Leo, Ngai-Tungwai[1]
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Preparation of functionally graded Cu/AIN/Cu electrode materials for thermoelectric devices (CPCI-S收录) 会议论文
HIGH-PERFORMANCE CERAMICS IV, PTS 1-3
作者:  Zhang, Huai-Quan[1,2];  Li, Jing-Feng[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/17
Preparation and microstructure of laminated ZrB2-SiC ceramics with porous ZrB2 interlayers (EI收录) 会议论文
Journal of Physics: Conference Series, Beijing, China, October 22, 2012 - October 26, 2012
作者:  Yuan, H.[1,2];  Li, J.[1];  Shen, Q.[1];  Zhang, L.[1]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/15
Thermal Stress Analysis of W/Cu Functionally Graded Materials by Using Finite Element Method (CPCI-S收录) 会议论文
12TH INTERNATIONAL SYMPOSIUM ON MULTISCALE, MULTIFUNCTIONAL AND FUNCTIONALLY GRADED MATERIALS (FGM 2012)
作者:  Yang, Zhenxiao[1,2];  Liu, Min[2];  Deng, Chunming[2];  Zhang, Xiaofeng[1,2];  Deng, Changguang[2]
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Thermal stress analysis of W/Cu functionally graded materials by using finite element method (EI收录) 会议论文
Journal of Physics: Conference Series, Beijing, China, October 22, 2012 - October 26, 2012
作者:  Yang, Zhenxiao[1,2];  Liu, Min[2];  Deng, Chunming[2];  Zhang, Xiaofeng[1,2];  Deng, Changguang[2]
收藏  |  浏览/下载:0/0  |  提交时间:2019/04/15
Using measuring devices to compensate springback in trail stamping step (EI收录) 会议论文
Proceedings of the 10th International Conference on Technology of Plasticity, ICTP 2011, Aachen, Germany, September 25, 2011 - September 30, 2011
作者:  Zhou, C.[1];  Liao, J.[1];  Zhou, X.H.[1];  Xia, Q.X.[1]
收藏  |  浏览/下载:2/0  |  提交时间:2019/04/15
Experimental and numerical study of the size effect on microstructure and mechanical behavior of Cu/Sn0.7Cu0.05Ni/Cu joints with very small s (EI收录) 会议论文
ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012
作者:  Li, Wei[1];  Zhou, Min-Bo[1];  Qin, Hong-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1]
收藏  |  浏览/下载:1/0  |  提交时间:2019/04/15


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