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Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR
收藏  |  浏览/下载:30/0  |  提交时间:2018/06/05
Interface Bonding of SA508-3 Steel Under Deformation and High Temperature Diffusion 期刊论文
PROCEEDINGS OF 21ST INTERNATIONAL ESAFORM CONFERENCE ON MATERIAL FORMING (ESAFORM 2018), 2018, 卷号: 1960, 页码: -
作者:  Xu, B;  Shao, CJ;  Sun, MY
收藏  |  浏览/下载:14/0  |  提交时间:2018/12/25
Room-temperature ductile inorganic semiconductor 期刊论文
NATURE MATERIALS, 2018, 卷号: 17, 期号: 5, 页码: 421, +
作者:  Shi, Xun;  Chen, Hongyi;  Hao, Feng;  Liu, Ruiheng;  Wang, Tuo
收藏  |  浏览/下载:32/0  |  提交时间:2018/12/28
Effects of buried oxide layer on indium diffusion in separation by implantation of oxygen 期刊论文
JOURNAL OF APPLIED PHYSICS, 2004, 卷号: 96, 期号: 6, 页码: 3217-3220
Chen, P; Zhu, M; Fu, RKY; Chu, PK; An, ZH; Liu, W; Montgomery, N; Biswas, S
收藏  |  浏览/下载:20/0  |  提交时间:2012/03/24


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