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CORC

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Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
What is the suitable segmentation crack density for atmospheric plasma sprayed thick thermal barrier coatings with the improved thermal shock resistance? 期刊论文
APPLIED SURFACE SCIENCE, 2018, 卷号: 431, 页码: 101, 111
作者:  Wang, L.;  Zhong, X. H.;  Shao, F.;  Ni, J. X.;  Yang, J. S.
收藏  |  浏览/下载：30/0  |  提交时间：2018/12/28
More Reliable Lithium-Sulfur Batteries: Status, Solutions and Prospects 期刊论文
WILEY-V C H VERLAG GMBH, 2017, 卷号: 29, 期号: 48, 页码: -
作者:  Fang, Ruopian;  Zhao, Shiyong;  Sun, Zhenhua;  Wang, Wei;  Cheng, Hui-Ming
收藏  |  浏览/下载：52/0  |  提交时间：2018/01/10
Preparation and thermal shock performance of thick alpha-Ta coatings by direct current magnetron sputtering (DCMS) 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2017, 卷号: 321, 页码: 19-25
Niu, Yunsong; Chen, Minghui; Wang, Jinlong; Yang, Lixin; Guo, Cean; Zhu, Shenglong; Wang, Fuhui
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17

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