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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 学科主题：Metallurgy & Metallurgical Engineering     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Nonuniform Recrystallization and Growth Behavior of Grains Dominated by Grain Misorientation and Interfacial Energy in Metastable beta Titanium Alloy 期刊论文 METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2018, 卷号: 49A, 期号: 12, 页码: 6390-6400 作者:  Huang, SS;  Ma, YJ;  Zhang, SL;  Youssef, SS;  Qiu, JK 收藏  |  浏览/下载：48/0  |  提交时间：2018/12/25 Microstructure Evolution and Growth Orientation of Directionally Solidified Mg-4 wt% Zn Alloy with Different Growth Rates 期刊论文 CHINESE ACAD SCIENCES, INST METAL RESEARCH, 2017, 卷号: 30, 期号: 12, 页码: 1185-1191 作者:  Jia, Hong-Min;  Feng, Xiao-Hui;  Yang, Yuan-Sheng;  Yang, YS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Yang, YS (reprint author), Shandong Key Lab High Strength Lightweight Metall, Jinan 250014, Shandong, Peoples R China. 收藏  |  浏览/下载：212/0  |  提交时间：2018/01/10 Directional Solidification  Mg-zn Alloy  Microstructure Evolution  Primary Dendritic Arm Spacing  Growth Orientation   Electromigration anisotropy introduced by tin orientation in solder joints 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 703, 页码: 264-271 Chen, Jian-Qiang; Liu, Kai-Lang; Guo, Jing-Dong; Ma, Hui-Cai; Wei, Song; Shang, Jian-Ku 收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17 Electromigration  Single crystal tin  Cu6Sn5  Intermetallic compounds  Orientation  Diffusion   Dependence of dislocation structure on orientation and slip systems in highly oriented nanotwinned Cu 期刊论文 ACTA MATERIALIA, 2017, 卷号: 127, 页码: 85-97 Lu, Qiuhong; You, Zesheng; Huang, Xiaoxu; Hansen, Niels; Lu, Lei 收藏  |  浏览/下载：39/0  |  提交时间：2017/08/17 Nanotwinned Cu  Slip system  Dislocation structure  TEM  Two-beam diffraction   Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating 期刊论文 ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2017, 卷号: 30, 期号: 2, 页码: 176-184 Zhao, Sheng-Sheng; Zhao, Yan-Hui; Cheng, Lv-Sha; Denisov, Vladimir Viktorovich; Koval, Nikolay Nikolaevich; Yu, Bao-Hai; Mei, Hai-Juan 收藏  |  浏览/下载：23/0  |  提交时间：2017/08/17 Magnetic field  Arc ion plating  Ti-Cu-N film  Residual stress  Hardness