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Thermally induced structure evolution on the corrosion behavior of Al-Ni-Y amorphous alloys 期刊论文
CORROSION SCIENCE, 2018, 卷号: 144, 页码: 172-183
作者:  Zhang, LM;  Zhang, SD;  Ma, AL;  Hu, HX;  Zheng, YG
收藏  |  浏览/下载:34/0  |  提交时间:2018/12/25
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载:20/0  |  提交时间:2018/06/05


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