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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Bandgap trimming and optical properties of Si3N4:Al microbelt phosphors for warm white light-emitting diodes 期刊论文
CRYSTENGCOMM, 2019, 卷号: 21, 期号: 43, 页码: 6566
作者:  Shen, Dongyi;  Shao, Yiran;  Zhu, Yingchun
收藏  |  浏览/下载：71/0  |  提交时间：2019/12/26
Molecular dynamics simulation of chip formation mechanism in single-crystal nickel nanomachining 期刊论文
SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2019, 卷号: 62, 期号: 11, 页码: 1916-1929
作者:  Zhu ZongXiao;  Peng Bin;  Feng RuiCheng;  Wang LinJun;  Jiao Shi
收藏  |  浏览/下载：3/0  |  提交时间：2020/06/02
A digital microfluidic diluter-based microalgal motion biosensor for marine pollution monitoring 期刊论文
BIOSENSORS & BIOELECTRONICS, 2019, 卷号: 143, 页码: 5
作者:  Han, Shuang;  Zhang, Qian;  Zhang, Xingcai;  Liu, Xianming;  Lu, Ling
收藏  |  浏览/下载：130/0  |  提交时间：2019/12/02
Eu2+-Activated Green-Emitting Phosphor Obtained from Eu3+ Ions doping Zeolite-3A in Air Surroundings and Its Efficient Green Light-Emitting Diodes 期刊论文
Nanoscale Research Letters, 2019, 卷号: 14
作者:  Wu,Honge;  Fei,Guang Tao;  Ma,Xiao Li;  Hu,Ze Min;  Gao,Xu Dong
收藏  |  浏览/下载：23/0  |  提交时间：2020/10/21
An Adaptive Thermal-Aware ECC Scheme for Reliable STT-MRAM LLC Design 期刊论文
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2019, 卷号: 27, 期号: 8, 页码: 1851-1860
作者:  Wu, Bi;  Zhang, Beibei;  Cheng, Yuanqing;  Wang, Ying;  Liu, Dijun
收藏  |  浏览/下载：70/0  |  提交时间：2019/12/10
A new CaF2-YAG: Ce composite phosphor ceramic for high-power and high-color-rendering WLEDs 期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2019, 卷号: 7, 期号: 28, 页码: 8569
作者:  Gu, Chi;  Wang, Xiao-Jun;  Xia, Chao;  Li, Shuxing;  Liu, Peng
收藏  |  浏览/下载：66/0  |  提交时间：2019/12/26
Variable wavelength laser device 专利
专利号: WO2019111675A1, 申请日期: 2019-06-13, 公开日期: 2019-06-13
作者:  GOTODA, MITSUNOBU;  TAKABAYASHI, MASAKAZU
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/31
Study on copper protrusion of through-silicon via in a 3-D integrated circuit 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 755, 页码: 66-74
作者:  Song M;  Wei ZQ;  Wang BY;  Chen L;  Chen L
收藏  |  浏览/下载：55/0  |  提交时间：2019/11/27

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