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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 发表日期：2018     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Ionic Wind Development in Corona Discharge for LED Cooling 期刊论文 IEEE TRANSACTIONS ON PLASMA SCIENCE, 2018, 卷号: 46, 期号: 5, 页码: 1821-1830 作者:  Wang, Jing[1];  Cai, Yi-Xi[2];  Li, Xiao-Hua[3];  Shi, Yun-Fei[4];  Bao, Ya-Chao[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/24 Corona discharge  electric field intensity (EFI)  high-power light-emitting diode (LED)  ionic wind  thermal management   Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262 作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30 Chip-scale package (CSP)  flip-chip die attach  high-power light-emitting diode (LED)  reliability  voids   Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文 Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 作者:  Wang, Z.;  Fan, J.;  Liu, J.;  Hu, A.;  Qian, C. 收藏  |  浏览/下载：11/0  |  提交时间：2019/12/30 Chip scale packages  Light emission  Light emitting diodes  Phosphors  Silicones  Ultraviolet radiation  Viscosity  Cure process  Harsh environment  High temperature cure  Light emitting diode (LED)  Low-power consumption  Ultra-violet light  Ultraviolet light intensity  Ultraviolet-assisted  Curing