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Application of HPIC-LBM in Large temporal-spatial scale 3D turbulent magnetic reconnection 会议论文
Washington, D.C, 2018-12-10
作者:  Yan, Hui;  Zhu BJ(朱伯靖)
收藏  |  浏览/下载：95/0  |  提交时间：2018/12/27
Deep Noise Tracking Network: A Hybrid Signal Processing/Deep Learning Approach to Speech Enhancement 会议论文
Hyderabad, India, 2018-9-2~2018-9-6
作者:  Nie S(聂帅);  Shan Liang;  Bin Liu;  Yaping Zhang;  Wenju Liu
收藏  |  浏览/下载：1/0  |  提交时间：2020/10/22
Hybrid Sorting Method for Successive Cancellation List Decoding of Polar Codes 会议论文
日本东京, 2017.11.24-2017.11.26
作者:  Li H;  Guo C;  Wang D
收藏  |  浏览/下载：18/0  |  提交时间：2018/06/01
Nonlinear GRAPPA Reconstruction with Virtual Coil Conception 会议论文
巴黎, 2018年
作者:  Haifeng Wang;  Yuchou Chang;  Leslie Ying;  Xin Liu;  Dong Liang
收藏  |  浏览/下载：15/0  |  提交时间：2019/01/31
Model Development of Electric Vehicles Based on Test Data Analysis 会议论文
日本神户, 2018
作者:  Namwook Kim;  Do Hyun Park;  Woong Lee;  Haeseong Jeong;  Chunhua Zheng
收藏  |  浏览/下载：12/0  |  提交时间：2019/01/31
Energy Efficient Design of Ionic Liquid based Gas Separation Processes 会议论文
Graz, AUSTRIA, JUN 10-13, 2018
作者:  Li, Xinyan;  Liang, Xiaodong;  Zhang, Xiangping;  Zhang, Suojiang;  Kontogeorgis, Georgios M.
收藏  |  浏览/下载：21/0  |  提交时间：2019/06/21
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Theory and Application Research of Hybrid Circuit Breaker in Ground-switching Auto-passing Neutral Section System 会议论文
28th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2018, Greifswald, Germany, 2018-09-23
作者:  Tian, Yu;  Dong, Enyuan;  Wang, Shuo;  Yu, Guanghui;  Zhang, Liyan
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Spectrum Allocation in Cognitive Radio Networks by Hybrid Analytic Hierarchy Process and Graph Coloring Theory 会议论文
2nd International Conference on Machine Learning and Intelligent Communications, MLICOM 2017, Weihai, China, 2017-08-05
作者:  Shi, Jianfei;  Li, Feng;  Liu, Xin;  Zhou, Mu;  Zhang, Jiangxin
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02

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