CORC

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CORC

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Residual thermal stress of SiC/Ti3SiC2/SiC joints calculation and relaxed by postannealing 期刊论文
INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, 2018, 卷号: 15, 期号: 5, 页码: 1157-1165
作者:  Zhou, Xiaobing;  Li, Yifan;  Huang, Qing;  Yang, Hui;  Ding, Shurong
收藏  |  浏览/下载：133/0  |  提交时间：2018/12/04
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:  Li, Xiaogang;  Xiong, Ruilin;  Hu, Yuting;  Wu, Junsheng;  Dong, Chaofang
收藏  |  浏览/下载：130/0  |  提交时间：2018/12/04
Microporous corrosion behavior of gold-plated printed circuit boards in an atmospheric environment with high salinity 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 11, 页码: 8877-8885
作者:  Li, Xiaogang;  Xiong, Ruilin;  Hu, Yuting;  Wu, Junsheng;  Dong, Chaofang
收藏  |  浏览/下载：133/0  |  提交时间：2018/12/04

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