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CORC

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Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17
Viscoplastic creep and microstructure evolution of Sn-based lead-free solders at low strain 期刊论文
ELSEVIER SCIENCE SA, 2017, 卷号: 701, 页码: 187-195
作者:  Zhang, Q. K.;  Hu, F. Q.;  Song, Z. L.;  Zhang, Z. F.;  Zhang, QK (reprint author), Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Ningbo 315201, Zhejiang, Peoples R China.
收藏  |  浏览/下载：22/0  |  提交时间：2018/01/10
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
Wang, Mingna; Wang, Jianqiu; Ke, Wei
收藏  |  浏览/下载：32/0  |  提交时间：2017/08/17
A superior interfacial reliability of Fe-Ni UBM during high temperature storage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 期号: 12, 页码: 8537-8545
Gao, Li-Yin; Li, Cai-Fu; Wan, Peng; Liu, Zhi-Quan
收藏  |  浏览/下载：22/0  |  提交时间：2017/08/17
Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC 期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2017, 卷号: 29, 期号: 3, 页码: 151-155
作者:  Zhang, Liang;  Liu, Zhi-quan;  Yang, Fan;  Zhong, Su-juan
收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02

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