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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2017    专题：北京大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Self-Terminating Confinement Approach for Large-Area Uniform Monolayer Graphene Directly over Si/SiOX by Chemical Vapor Deposition 期刊论文 ACS NANO, 2017 Pang, Jinbo; Mendes, Rafael G.; Wrobel, Pawel S.; Wlodarski, Michal D.; Ta, Huy Quang; Zhao, Liang; Giebeler, Lars; Trzebicka, Barbara; Gemming, Thomas; Fu, Lei; Liu, Zhongfan; Eckert, Juergen; Bachmatiuk, Alicja; Ruemmeli, Mark H. 收藏  |  浏览/下载：11/0  |  提交时间：2017/12/03 direct monolayer graphene growth  uniform graphene  chemical vapor deposition  silicon  grain boundaries  optical transmission  carrier mobility  FIELD-EFFECT TRANSISTORS  SINGLE-CRYSTAL GRAPHENE  HIGH-QUALITY  CARBON NANOTUBES  LAYER GRAPHENE  DIRECT GROWTH  POLYCRYSTALLINE GRAPHENE  ELECTRICAL-PROPERTIES  BILAYER GRAPHENE  GRAIN-BOUNDARIES   Diameter-specific growth of single-walled carbon nanotubes using tungsten supported nickel catalysts 期刊论文 CARBON, 2017 Li, Meihui; Yang, Feng; Ding, Li; Liu, Xiyan; Zhang, Zeyao; Zhang, Daqi; Zhao, Xiulan; Yang, Juan; Li, Yan 收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03 SELECTIVE GROWTH  CHIRALITY  QUARTZ  PHOTOVOLTAICS  MORPHOLOGY   Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017 Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng 收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03 3-D packaging  chip-on-chip (CoC) integration  reliability  through silicon via (TSV)  wafer-on-wafer (WoW) integration  PIEZORESISTIVE STRESS SENSOR  THROUGH-SILICON  RELIABILITY  INTERCONNECTS  VOLUME  VIAS   Investigations of silicon wafer bonding utilizing sputtered Al and Sn films 期刊论文 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2017 Zhu, Zhiyuan; Yu, Min; Jin, Yufeng 收藏  |  浏览/下载：1/0  |  提交时间：2017/12/03 DEVICES  MEMS