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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2017    内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Ultrasound-assisted soldering of Cu alloy using a Ni-foam reinforced Sn composite solder 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017 作者:  Wang, Qiwei;  Xiao, Yong*;  Zhang, Xingyi 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04 ultrasonic vibration  intermetallic compound  Ni-Sn composite solder  microstructure  shear strength   In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03 Synchrotron radiation  heat preservation stage  microstructure  Cu addition  mechanism   Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering under temperature gradient 会议论文 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01 作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Ma, Haitao;  Wang, Yunpeng 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03 soldering  IMC grain  orientation  temperature gradient  anisotropy  electron backscattering diffraction (EBSD)   Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes 会议论文 physics and simulation of optoelectronic devices xxv, san francisco, ca, united states, 2017-01-30 作者:  Zhang, Hongyou;  Liang, Xuejie;  Cai, Wanshao;  Zah, Chungen;  Liu, Xingsheng 收藏  |  浏览/下载：79/0  |  提交时间：2017/05/27