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Annealing effects on the microstructure and properties of an Fe-based Metallic-Intermetallic Laminate (MIL) composite 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 卷号: 665, 页码: 47-58
作者:  Wang, Yu;  Zhou, Shenggao;  Vecchio, Kenneth S.
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/09
Microstructure evolution in Fe-based-aluminide metallic-intermetallic laminate (MIL) composites 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2016, 卷号: 649, 页码: 325-337
作者:  Wang, Yu;  Vecchio, Kenneth S.
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/Cu interconnects 期刊论文
MATERIALS & DESIGN, 2016, 卷号: 89, 页码: 116-120
作者:  Huang, M. L.;  Yang, F.;  Zhao, N.
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/09
On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient 期刊论文
MATERIALS LETTERS, 2016, 卷号: 172, 页码: 211-215
作者:  Kunwar, Anil;  Ma, Haoran;  Ma, Haitao;  Sun, Junhao;  Zhao, Ning
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
Intermetallic Cooperation in Olefin Polymerization Catalyzed by a Binuclear Samarocene Hydride: A Theoretical Study 期刊论文
ORGANOMETALLICS, 2016, 卷号: 35, 页码: 778-784
作者:  Luo, Gen;  Luo, Yi;  Hou, Zhaomin;  Qu, Jingping
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/09
Influence of Adhesive and Ni on the Interface between Mg and Fe in the Laser-TIG-Adhesive Hybrid Welding Joint 期刊论文
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2016, 卷号: 17, 页码: 823-827
作者:  Wang, Hongyang;  Song, Gang
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/09
Effect of ultrasonic treatment on formation of iron-containing intermetallic compounds in Al-Si alloys 期刊论文
CHINA FOUNDRY, 2016, 卷号: 13, 页码: 316-321
作者:  Zhang, Yu-bo;  Kateryna, Svynarenko;  Li, Ting-ju
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/09
Effect of cooling condition and Ag on the growth of intermetallic compounds in Sn-based solder joints 期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2016, 卷号: 122
作者:  Ma, Haoran;  Kunwar, Anil;  Guo, Bingfeng;  Sun, Junhao;  Jiang, Chengrong
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/09
Novel growth of whole preferred orientation intermetallic compound interconnects for 3D IC packaging 会议论文
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, NV, 2016-05-31
作者:  Huang, M. L.;  Zhang, Z. J.;  Yang, F.;  Zhao, N.
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2016, 卷号: 682, 页码: 1-6
作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Dong, W.;  Ma, H. T.
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09


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