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Special Issue: Inelastic Damage Behaviors and/or Nano, Bio and Micro Materials Preface 期刊论文
INTERNATIONAL JOURNAL OF DAMAGE MECHANICS, 2016, 卷号: 25, 页码: 3-3
作者:  Chen, Zhen
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
A novel 2D silicon nano-mold fabrication technique for linear nanochannels over a 4 inch diameter substrate 期刊论文
SCIENTIFIC REPORTS, 2016, 卷号: 6, 页码: 18921
作者:  Yin, Zhifu;  Qi, Liping;  Zou, Helin;  Sun, Lei
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
Effects of ultrasonic agitation on adhesion strength of micro electroforming Ni layer on Cu substrate 期刊论文
ULTRASONICS SONOCHEMISTRY, 2016, 卷号: 29, 页码: 1-10
作者:  Zhao, Zhong;  Du, Liqun;  Xu, Zheng;  Shao, Ligeng
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/09
Design and evaluation of a remote measurement system for the online monitoring of rail vibration signals 期刊论文
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART F-JOURNAL OF RAIL AND RAPID TRANSIT, 2016, 卷号: 230, 页码: 724-733
作者:  Liu Chong;  Wei Jiahong;  Zhang Zhixin;  Liang Junsheng;  Ren Tongqun
收藏  |  浏览/下载:11/0  |  提交时间:2019/12/09
Flame propagation behaviors of nano- and micro-scale PMMA dust explosions 期刊论文
JOURNAL OF LOSS PREVENTION IN THE PROCESS INDUSTRIES, 2016, 卷号: 40, 页码: 101-111
作者:  Zhang, Xinyan;  Yu, Jianliang;  Yan, Xingqing;  Xie, Qiaofeng;  Gao, Wei
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/09
A Novel Flat Micro Heat Pipe With a Patterned Glass Cover 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 卷号: 6, 页码: 1053-1057
作者:  Luo, Yi;  Yu, Beike;  Wang, Xiaodong;  Li, Congming
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/09
Electrohydrodynamic atomization deposition and mechanical polishing of PZT thick films 期刊论文
CERAMICS INTERNATIONAL, 2016, 卷号: 42, 页码: 12623-12629
作者:  Wang, D.;  Li, X.;  Shi, P.;  Zhao, X.;  Liang, J.
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/09
A novel nanopin model based on a Y-junction carbon nanotube 期刊论文
JOURNAL OF APPLIED PHYSICS, 2016, 卷号: 120
作者:  Zhang, Zhong-Qiang;  Zhong, Jun;  Ye, Hong-Fei;  Liu, Zhen;  Cheng, Guang-Gui
收藏  |  浏览/下载:6/0  |  提交时间:2019/12/09
Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process 期刊论文
MICROMACHINES, 2016, 卷号: 7, 页码: 1-12
作者:  Du, Liqun;  Yang, Tong;  Zhao, Ming;  Tao, Yousheng;  Luo, Lei
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/09
Influence of initial current density on bonding strength between Ni layer and Cu substrate in microelectroforming 期刊论文
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2016, 卷号: 30, 页码: 2013-2023
作者:  Shao, Ligeng;  Wang, Liding;  Du, Liqun
收藏  |  浏览/下载:5/0  |  提交时间:2019/12/09


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