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科研机构
金属研究所 [21]
内容类型
期刊论文 [21]
发表日期
2010 [21]
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共21条,第1-10条
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发表日期:2010
专题:金属研究所
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STUDY OF MICROSTRUCTURE AND STRESS CORROSION CRACKING BEHAVIOR IN WELDING TRANSITION ZONE OF Ni-BASED ALLOYS
期刊论文
ACTA METALLURGICA SINICA, 2010, 卷号: 46, 期号: 10, 页码: 1258-1266
作者:
Hou Juan
;
Peng Qunjia
;
Shoji, Testuo
;
Wang Jianqiu
;
Ke Wei
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/02/02
Ni-based alloy
similar/dissimilar metal weld
microstructure
residual strain
stress corrosion cracking
STUDY OF MICROSTRUCTURE AND STRESS CORROSION CRACKING BEHAVIOR IN WELDING TRANSITION ZONE OF Ni-BASED ALLOYS
期刊论文
ACTA METALLURGICA SINICA, 2010, 卷号: 46, 期号: 10, 页码: 1258-1266
作者:
Hou Juan
;
Peng Qunjia
;
Shoji, Testuo
;
Wang Jianqiu
;
Ke Wei
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2021/02/02
Ni-based alloy
similar/dissimilar metal weld
microstructure
residual strain
stress corrosion cracking
Mg/Al REACTION AND MECHANICAL PROPERTIES OF Al ALLOY/Mg ALLOY FRICTION STIR WELDING JOINTS
期刊论文
ACTA METALLURGICA SINICA, 2010, 卷号: 46, 期号: 5, 页码: 589-594
作者:
Wang Dong
;
Liu Jie
;
Xia Bolue
;
Ma Zongyi
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  |  
浏览/下载:15/0
  |  
提交时间:2021/02/02
friction stir welding
dissimilar alloy welding
6061 Al alloy
AZ31 Mg alloy
microstructure
Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate
期刊论文
Journal of Electronic Materials, 2010, 卷号: 39, 期号: 3, 页码: 333-337
X. F. Zhang
;
J. D. Guo
;
J. K. Shang
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  |  
浏览/下载:12/0
  |  
提交时间:2012/04/13
Polarity effect
current stressing
effective charge
FeNi
interfacial
reactions
thin-films
alloy
segregation
diffusion
kinetics
Crack propagation of single crystal beta-Sn during in situ TEM straining
期刊论文
Journal of Electron Microscopy, 2010, 卷号: 59, 页码: S61-S66
P. J. Shang
;
Z. Q. Liu
;
D. X. Li
;
J. K. Shang
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  |  
浏览/下载:13/0
  |  
提交时间:2012/04/13
in situ TEM
straining
single crystal Sn
slip system
self-diffusion
crack propagation
free solder alloys
lead-free solders
thermal fatigue
behavior
creep
tin
pb
joints
ag
deformation
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints
期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 8, 页码: 737-742
X. J. Wang
;
Q. L. Zeng
;
Q. S. Zhu
;
Z. G. Wang
;
J. K. Shang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2012/04/13
Strength
Fracture strain
Voids
Solder
al interconnects
electromigration
growth
lines
sn
Enhanced stress relaxation of Sn-3.8Ag-0.7Cu solder by electrical current
期刊论文
Journal of Materials Research, 2010, 卷号: 25, 期号: 6, 页码: 1172-1178
H. Y. Liu
;
Q. S. Zhu
;
L. Zhang
;
Z. G. Wang
;
J. K. Shang
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2012/04/13
pb-free solder
electromigration-induced failure
creep-behavior
joints
alloy
sn
tin
composite
mechanism
Microstructure Investigation on the Triple Junction with an Adjoining Twin Boundary in Nanocrystalline Palladium
期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 11, 页码: 1047-1050
Y. C. Wang
;
Z. X. Su
;
D. H. Ping
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  |  
浏览/下载:11/0
  |  
提交时间:2012/04/13
Triple junction
Grain boundary
Molecular statics
High-resolution
transmission electron microscopy (HRTEM)
high-purity nickel
grain-boundary
corrosion
joints
hrem
Effect of Heat Input Conditions on Microstructure and Mechanical Properties of Friction-Stir-Welded Pure Copper
期刊论文
Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science, 2010, 卷号: 41A, 期号: 8, 页码: 2010-2021
P. Xue
;
G. M. Xie
;
B. L. Xiao
;
Z. Y. Ma
;
L. Geng
收藏
  |  
浏览/下载:44/0
  |  
提交时间:2012/04/13
aluminum
alloy
superplasticity
parameters
hardness
Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints
期刊论文
Microelectronic Engineering, 2010, 卷号: 87, 期号: 4, 页码: 601-609
H. F. Zou
;
Z. F. Zhang
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  |  
浏览/下载:11/0
  |  
提交时间:2012/04/13
Sn-Cu solder
Interfacial strength
Intermetallic compounds
Ductile-to-brittle transition
Strain rate
Fracture
lead-free solders
intermetallic compounds
tensile properties
microstructure
growth
alloy
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