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Microcantilever Probe Cards With Silicon and Nickel Composite Micromachining Technique for Wafer-Level Burn-In Testing 期刊论文
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 卷号: 32, 期号: 2, 页码: 468-477
Wang, F; Li, XX; Feng, SL
收藏  |  浏览/下载:11/0  |  提交时间:2011/12/17
Post-CMOS Compatible Micromachining Technique for On-Chip Passive RF Filter Circuits 期刊论文
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 卷号: 32, 期号: 4 Pages, 页码: 759-765
Wu, ZZ; Gu, L; Li, XX
收藏  |  浏览/下载:8/0  |  提交时间:2012/05/12
Microcantilever Probe Cards With Silicon and Nickel Composite Micromachining Technique for Wafer-Level Burn-In Testing 期刊论文
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 卷号: 32, 期号: 3 Pages, 页码: 468-477
Wang, F; Li, XX; Feng, SL ,
收藏  |  浏览/下载:9/0  |  提交时间:2012/05/12
Micromachining of an SU-8 flapping-wing flying micro-electro-mechanical system 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2009, 卷号: 19, 期号: 8, 页码: 85028-85028
Dargent, T; Bao, XQ; Grondel, S; Le Brun, G; Paquet, JB; Soyer, C; Cattan, E
收藏  |  浏览/下载:10/0  |  提交时间:2012/03/24
Post-CMOS Compatible Micromachining Technique for On-Chip Passive RF Filter Circuits 期刊论文
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 卷号: 32, 期号: 4, 页码: 759-765
Wu, ZZ; Gu, L; Li, XX
收藏  |  浏览/下载:14/0  |  提交时间:2011/12/17
Post-CMOS Compatible Micromachining Technique for On-Chip Passive RF Filter Circuits 期刊论文
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 卷号: 32, 期号: 4, 页码: 759-765
Wu, ZZ; Gu, L; Li, XX
收藏  |  浏览/下载:11/0  |  提交时间:2011/12/17


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