Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys

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	Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys
	R. ; Zhang Liu, Z. J. ; Li, L. L. ; An, X. H. ; Zhang, Z. F.
刊名	Scientific Reports
	2015
卷号	5
关键词	centered-cubic metals stacking-fault energy high-pressure torsion cu-zn alloys microstructural evolution grain-size deformation boundaries steel dislocations
ISSN号	2045-2322
原文出处	://WOS:000352032200001
公开日期	2015-05-08
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/73866]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	R.,Zhang Liu, Z. J.,Li, L. L.,et al. Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys[J]. Scientific Reports,2015,5.
APA	R.,Zhang Liu, Z. J.,Li, L. L.,An, X. H.,&Zhang, Z. F..(2015).Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys.Scientific Reports,5.
MLA	R.,et al."Microscopic mechanisms contributing to the synchronous improvement of strength and plasticity (SISP) for TWIP copper alloys".Scientific Reports 5(2015).