Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea
Kang RX(康瑞雪)1,2; Liang J(梁军)1; Liu BX(刘百幸)1; Peng ZJ(彭振军)1
刊名Journal of The Electrochemical Society
2014
卷号161期号:10页码:D534-D539
ISSN号0013-4651
通讯作者梁军
英文摘要The deposition of copper (Cu) on aluminum (Al) is important for submicron interconnects and plating treatments of Al-based substrate. While aqueous deposition of Cu on Al is challenging on several technological and environmental problems. In this paper, we described electroless deposition of Cu onto Al surface through galvanic replacement from a simple and stable choline chloride (ChCl) based ionic liquid comprising a 1:2 stoichiometric mixture of ChCl and ethylene glycol (EG). Thermodynamic feasibility of Cu deposition by galvanic replacement on Al in ChCl-EG ionic liquid was studied by cyclic voltammetry. The effect of thiourea (TU) on the kinetics of galvanic replacement and the characterization of Cu layers were investigated by open circuit potential (OCP), electrochemical noise (ECN), scanning electron microscopy (SEM) and X-ray diffraction (XRD). Results showed that sustained deposition of Cu on Al surface was achieved in both the ChCl-EG ionic liquid solutions without and with addition of TU. The presence of TU in the ionic liquid restrained the galvanic replacement process, resulting in obtaining a compact and uniform Cu layer on Al surface.
学科主题材料科学与物理化学
收录类别SCI
资助信息the “Hundred Talents Program” of Chinese Academy of Sciences (J. Liang)
语种英语
WOS记录号WOS:000341217500065
公开日期2014-11-27
内容类型期刊论文
源URL[http://210.77.64.217/handle/362003/6812]  
专题兰州化学物理研究所_固体润滑国家重点实验室
作者单位1.Chinese Acad Sci, Lanzhou Inst Chem Phys, State Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China
2.Univ Chinese Acad Sci, Beijing 100080, Peoples R China
推荐引用方式
GB/T 7714
Kang RX,Liang J,Liu BX,et al. Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea[J]. Journal of The Electrochemical Society,2014,161(10):D534-D539.
APA Kang RX,Liang J,Liu BX,&Peng ZJ.(2014).Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea.Journal of The Electrochemical Society,161(10),D534-D539.
MLA Kang RX,et al."Copper Galvanic Replacement on Aluminum from a Choline Chloride Based Ionic Liquid: Effect of Thiourea".Journal of The Electrochemical Society 161.10(2014):D534-D539.
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