Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method

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	Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method
	Cao, H. B.; Zhang, X. H.; Liu, H. L.
	2010
会议名称	5th International Conference on Waste Management and Technology
会议日期	DEC 15-17, 2010
会议地点	Beijing, PEOPLES R CHINA
关键词	waste printed circuit boards chemical swelling peeling strength monomer liberation degree ELECTRONIC SCRAP RECOVERY EQUIPMENT METALS
页码	309-313
中文摘要	In this paper, ten kinds of chemical solvents were used to immerse the waste printed circuit boards (PCBs). Comparing the effects of chemical swelling solvents on the peeling strength between copper foils and base plates from PCBs, solvent D, solvent F, acetone and water were selected as the typical chemical swelling solvents. After chemical swelling treatment, the monomer liberation degree and scrapping time were further investigated to obtain particles with certain size distribution. The experimental results showed that scrapping after chemical swelling treatment could remarkably increase the monomer liberation degree of metals. The chemical swelling effects of the four solvents were in the sequence solvent D > solvent F > acetone > water. The longer time and higher temperature favored the decrease of peeling strength between copper foils and base plates from PCBs. The copper foils could fall off from the base plates spontaneously after immersing in solvent D at 150 degrees C for 3 h or at 140 degrees C for 5 h. This study demonstrated that chemical swelling treatment was very conductive to achieve higher monomer liberation degree of metals with coarser particle sizes.
收录类别	ISTP
会议网址	://WOS:000289218300069
会议录	SELECTED PROCEEDINGS OF THE FIFTH INTERNATIONAL CONFERENCE ON WASTE MANAGEMENT AND TECHNOLOGY(ICWMT 5) 页: 309-313
会议录出版者	Sci Res Publ, Inc-Srp
语种	英语
内容类型	会议论文
源URL	[http://ir.ipe.ac.cn/handle/122111/11071]
专题	过程工程研究所_研究所（批量导入）
推荐引用方式 GB/T 7714	Cao, H. B.,Zhang, X. H.,Liu, H. L.. Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method[C]. 见:5th International Conference on Waste Management and Technology. Beijing, PEOPLES R CHINA. DEC 15-17, 2010.://WOS:000289218300069.