Coercivity enhancement of anisotropic die-upset Nd-Fe-B powders by Pr-Cu alloy diffusion

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	Coercivity enhancement of anisotropic die-upset Nd-Fe-B powders by Pr-Cu alloy diffusion
	hanjingzhi，jbyang ; Fangming Wan,1 Jingzhi Han,1,a) Yinfeng Zhang,1 Xiaodong Zhang,1 Jinbo Yang,1,a) Yingchang Yang,1 Boping Hu,2 Xiaolei Rao,2 Daoyan Cai,2 Zhian Chen,2 Renjie Chen,3 and Aru Yan3
刊名	J. App. Phys
	2013-05-16
期号	113 页码:193902-1—193902-4
通讯作者	hanjingzhi，jbyang
合作状况	李雨桐
中文摘要	The grain boundary diffusion treatment using the low melting point Pr-Cu eutectic alloy was applied to enhance the coercivity of anisotropic die-upset Nd-Fe-B powders. It was found that the room temperature coercivity of the powders increases from 13 kOe to 24 kOe. The thickness of the grain boundary layer was increased and the Fe and Co content in the grain boundary phases was decreased. The modified boundary layers may thus increase the domain wall nucleation field, leading to an enhancement in the coercivity. The diffusion of Pr-Cu alloy prevents the loss of continuity of the Nd-rich grain boundary phase and retains the crystal texture in the initial grains.
学科主题	永磁材料研究室
原文出处	SCI收录
公开日期	2013-12-16
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/9916]
专题	宁波材料技术与工程研究所_宁波所知识产出
推荐引用方式 GB/T 7714	hanjingzhi，jbyang,Fangming Wan,1 Jingzhi Han,1,a) Yinfeng Zhang,1 Xiaodong Zhang,1 Jinbo Yang,1,a) Yingchang Yang,1 Boping Hu,2 Xiaolei Rao,2 Daoyan Cai,2 Zhian Chen,2 Renjie Chen,3 and Aru Yan3. Coercivity enhancement of anisotropic die-upset Nd-Fe-B powders by Pr-Cu alloy diffusion[J]. J. App. Phys,2013(113):193902-1—193902-4.
APA	hanjingzhi，jbyang,&Fangming Wan,1 Jingzhi Han,1,a) Yinfeng Zhang,1 Xiaodong Zhang,1 Jinbo Yang,1,a) Yingchang Yang,1 Boping Hu,2 Xiaolei Rao,2 Daoyan Cai,2 Zhian Chen,2 Renjie Chen,3 and Aru Yan3.(2013).Coercivity enhancement of anisotropic die-upset Nd-Fe-B powders by Pr-Cu alloy diffusion.J. App. Phys(113),193902-1—193902-4.
MLA	hanjingzhi，jbyang,et al."Coercivity enhancement of anisotropic die-upset Nd-Fe-B powders by Pr-Cu alloy diffusion".J. App. Phys .113(2013):193902-1—193902-4.