Deformation behavior of single crystal silicon induced by laser shock peening | |
Liu YX(柳沅汛); Wu XQ(吴先前); Wang X(王曦); Wei YP(魏延鹏); Huang CG(黄晨光) | |
2013 | |
会议名称 | 2nd International Symposium on Laser Interaction with Matter (LIMIS) |
会议日期 | SEP 09-12, 2012 |
通讯作者邮箱 | huangcg@imech.ac.cn |
会议地点 | Xian, PEOPLES R CHINA |
关键词 | Laser shock peening single crystal silicon plastic deformation surface morphology residual stress |
卷号 | 8796 |
页码 | 87962M |
通讯作者 | Liu, YX (reprint author), Chinese Acad Sci, Inst Mech, Key Lab Mech Fluid Solid Coupling Syst, Beijing 100190, Peoples R China. |
中文摘要 | Laser shock peening can significantly improve the fatigue life of metals by introducing plastic deformation and compressive residual stresses near the surface. It has been widely applied on metals for surface strengthening. The plastic deformation behavior of brittle materials such as single crystal silicon under LSP is rarely studied. In the present research, the surface integrity and residual compressive stress of P-type single crystal silicon in < 100 > orientation shocked by LSP at imposed high temperature were measured to investigate the plastic deformation mechanism at high temperature and high compressive stress. The surface morphology of shocked silicon, observed using optical microscopy, showed that the cracks on the shocked silicon surface became less and the fragments were smaller while the temperature or the laser power density increased, which indicates that the plasticity of single crystal silicon is improved at high stress and temperature. However, the excessive laser power density would lead to local damage of the shocked silicon. The residual stress, measured using Raman scattering method, showed that the compressive residual stresses with magnitude of a few hundreds of MPa were introduced in the surface layer of silicon after LSP at imposed high temperature, and it increased with respect to the temperature and the laser power density. The experimental result indicates the material has experienced the plastic deformation and provides a potential processing method to improve the mechanical behavior of brittle material like single crystal silicon. |
收录类别 | CPCI-S ; EI |
产权排序 | [Liu, Yuanxun; Wu, Xianqian; Wang, Xi; Wei, Yanpeng; Huang, Chenguang] Chinese Acad Sci, Inst Mech, Key Lab Mech Fluid Solid Coupling Syst, Beijing 100190, Peoples R China |
会议网址 | http://dx.doi.org/10.1117/12.2011314 |
会议录 | 2ND INTERNATIONAL SYMPOSIUM ON LASER INTERACTION WITH MATTER (LIMIS 2012) |
会议录出版者 | SPIE-INT SOC OPTICAL ENGINEERING |
学科主题 | Optics ; Physics ; Applied |
语种 | 英语 |
ISSN号 | 0277-786X |
ISBN号 | 978-0-8194-9639-3 |
WOS记录号 | WOS:000323339600094 |
内容类型 | 会议论文 |
源URL | [http://dspace.imech.ac.cn/handle/311007/47576] |
专题 | 力学研究所_流固耦合系统力学重点实验室(2012-) |
推荐引用方式 GB/T 7714 | Liu YX,Wu XQ,Wang X,et al. Deformation behavior of single crystal silicon induced by laser shock peening[C]. 见:2nd International Symposium on Laser Interaction with Matter (LIMIS). Xian, PEOPLES R CHINA. SEP 09-12, 2012.http://dx.doi.org/10.1117/12.2011314. |
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