Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application

	Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application
	An Lulu; Yang Zenghui; Zeng Xiaoliang; Hu Wanbiao; Yu Yuanlie; Zhang Junyan; Wang Qihua
刊名	Chemical Engineering Journal
	2022
期号	431 页码:133740
内容类型	期刊论文
源URL	[http://ir.licp.cn/handle/362003/29961]
专题	兰州化学物理研究所_先进润滑与防护材料研究发展中心
通讯作者	An Lulu; Wang Qihua
推荐引用方式 GB/T 7714	An Lulu,Yang Zenghui,Zeng Xiaoliang,et al. Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application[J]. Chemical Engineering Journal,2022(431):133740.
APA	An Lulu.,Yang Zenghui.,Zeng Xiaoliang.,Hu Wanbiao.,Yu Yuanlie.,...&Wang Qihua.(2022).Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application.Chemical Engineering Journal(431),133740.
MLA	An Lulu,et al."Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application".Chemical Engineering Journal .431(2022):133740.