Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films

doi:10.1021/acsapm.2c00929

	Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films
	Liu, Shuaishuai 1,2,3; Wang, Yanyan 1,2; Xiao, Chao 1,2; Jiang, Miao 1,2; Ding, Xin 1,2; Zhang, Hui 3; Zheng, Kang 1,2; Chen, Lin 1,2; Tian, Xingyou 1,2; Zhang, Xian 1,2
刊名	ACS APPLIED POLYMER MATERIALS
	2022-08-26
关键词	g-C3N4 PI film thermal conductivity electrical insulation casting
ISSN号	2637-6105
DOI	10.1021/acsapm.2c00929
通讯作者	Wang, Yanyan(wangyy@issp.ac.cn) ; Zhang, Hui(zhhui@ahu.edu.cn) ; Zhang, Xian(xzhang@issp.ac.cn)
英文摘要	Owing to superior comprehensive performance, polyimide film (PI) has been extensively used as flexible substrate to support and fix electronic components. However, the current PI film has inferior thermal conductivity, especially in the vertical direction, causing failure of electronic devices in overheating conditions. Herein, an electrically insulating pea-pod-like filler with high thermal conductivity in both horizontal and vertical directions was prepared by encapsulating interconnected carbon microsphere (CM) with graphene-like carbon nitride (g-C3N4). The resultant thermal conductivity of PI film in horizontal and vertical directions has been improved by 11 (1.98 W m(-1) K-1) and 2.4 (0.43 W m(-1) K-1) times at 30 wt % CM@g-C3N4 loading, respectively. Furthermore, benefiting from satisfactory light absorption of CM@g-C3N4, the PI/CM@g-C3N4 film displays rapid heating capability under illumination. Meanwhile, the PI/CM@g-C3N4 film keeps intrinsic electrical insulation, thermal and dimensional stabilities. This work provides an effective method to solve the bottleneck of the current PI film in inadequate thermal conductivity.
资助项目	National Natural Science Foundation of China[U21A2094] ; CASHIPS Director?s Fund[YZJJZX202015] ; Anhui Province Postdoc-toral Researcher Research Project[E24F0D27]
WOS关键词	COMPOSITES ; EFFICIENT ; G-C3N4 ; BN
WOS研究方向	Materials Science ; Polymer Science
语种	英语
出版者	AMER CHEMICAL SOC
WOS记录号	WOS:000849219300001
资助机构	National Natural Science Foundation of China ; CASHIPS Director?s Fund ; Anhui Province Postdoc-toral Researcher Research Project
内容类型	期刊论文
源URL	[http://ir.hfcas.ac.cn:8080/handle/334002/131896]
专题	中国科学院合肥物质科学研究院
通讯作者	Wang, Yanyan; Zhang, Hui; Zhang, Xian
作者单位	1.Chinese Acad Sci, Key Lab Photovolta & Energy Conservat Mat, Hefei 230088, Peoples R China 2.Chinese Acad Sci, Inst Solid State Phys, Hefei Inst Phys Sci, Hefei 230031, Peoples R China 3.Anhui Univ, Sch Mat Sci & Engn, Hefei 230601, Peoples R China
推荐引用方式 GB/T 7714	Liu, Shuaishuai,Wang, Yanyan,Xiao, Chao,et al. Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films[J]. ACS APPLIED POLYMER MATERIALS,2022.
APA	Liu, Shuaishuai.,Wang, Yanyan.,Xiao, Chao.,Jiang, Miao.,Ding, Xin.,...&Zhang, Xian.(2022).Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films.ACS APPLIED POLYMER MATERIALS.
MLA	Liu, Shuaishuai,et al."Pea-Pod-like Carbon Microspheres Encapsulated by Graphene-like Carbon Nitride for Enhanced Thermal Conductivity in Polyimide Films".ACS APPLIED POLYMER MATERIALS (2022).