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THERMAL SHOCK BUCKLING OF A FUNCTIONALLY GRADED CIRCULAR PLATE
Zhang, Jinghua1; Zhao, Xingxing2
2017
英文摘要The dynamic buckling of a functionally graded material (FGM) circular plate subjected to thermal shock is studied in the Hamilton system. It is assumed that the lower surface of the circular plate is subjected to uniform thermal shock. Considering the one-dimensional heat conduction problem and basing on theory of Fourier heat conduction, the dynamic temperature fields of the FGM circular plate under thermal shock are obtained. The dynamic buckling problem of the FGM circular plate is fmally reduced to zero-eigenvalue problem in the symplectic space. The critical loads and buckling modes of the functionally graded circular plate correspond to generalized eigenvalue and eigen solution, and can be obtained through bifurcation condition. In this study, the buckling characteristics of the FGM plate subjected to thermal shock are solved by symplectic method, and the solution process is given. The effects of the material constitution, structural geometric parameters and thermal shock load on the critical temperature are discussed.
会议录PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 1
会议录出版者AMER SOC MECHANICAL ENGINEERS
会议录出版地THREE PARK AVENUE, NEW YORK, NY 10016-5990 USA
语种英语
资助项目National Natural Science Foundation of China[11262010][11272278]
WOS研究方向Engineering
WOS记录号WOS:000400539800011
内容类型会议论文
源URL[http://119.78.100.223/handle/2XXMBERH/36278]  
专题理学院
通讯作者Zhang, Jinghua
作者单位1.Lanzhou Univ Technol, Sch Sci, Lanzhou, Gansu, Peoples R China
2.Taiyuan Boiler Grp Co Ltd, Taiyuan, Shanxi, Peoples R China
推荐引用方式
GB/T 7714
Zhang, Jinghua,Zhao, Xingxing. THERMAL SHOCK BUCKLING OF A FUNCTIONALLY GRADED CIRCULAR PLATE[C]. 见:.
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