Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties

doi:10.1002/mame.202100185

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	Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties
	Yang, Jing 1,2; Tao, Liming 2,3; Cao, Pengrui 2,3; Yang, Zenghui 2; Zhang, Xinrui 2,3; Wang, Qihua 2,3; Wang, Tingmei 2,3; Luo, Heming 1; Zhang, Yaoming 2,3
刊名	MACROMOLECULAR MATERIALS AND ENGINEERING
	2021-08
卷号	306 期号:8
关键词	crosslinking density epoxy resins post-heating shape memory effects
ISSN号	1438-7492
DOI	10.1002/mame.202100185
英文摘要	Shape memory epoxy resin (SMEP) with tailorable properties has gained wide attention. Herein, a series of photocured diphenyl epoxy with excellent shape memory effects, based on the epoxy monomer diglycidyl ether of biphenyl (DGEBP) and M-xylylenediamine (MXDA), is fabricated. Fourier transform infrared spectrometer (FTIR) is used to verify the mix-curing process. Differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), polarized light microscope (POM), and X-ray diffraction (XRD) are applied to analyze the microstructure of the film. The molar ratio of the raw material and the post-heating could tune the crosslinking density, which allows the prepared epoxy resin to present a tailorable shape memory effect. Besides, this epoxy resin exhibits an excellent triple-shape memory effect due to the wide transition temperature. It is worth of noting that post-heating induced the self-assembly of biphenyl unit of the lamellar structure due to pi-pi interactions that causes an adjustable shape memory effect. This work offers a novel SMEP with potential application in the thermal history trace field.
WOS研究方向	Materials Science ; Polymer Science
语种	英语
出版者	WILEY-V C H VERLAG GMBH
WOS记录号	WOS:000659808400001
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/149002]
专题	附属中学石油化工学院
作者单位	1.Lanzhou Univ Technol, Coll Petrochem Technol, Lanzhou 730050, Peoples R China; 2.Chinese Acad Sci, Lanzhou Inst Chem Phys, Key Lab Sci & Technol Wear & Protect Mat, Lanzhou 730000, Peoples R China; 3.Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China
推荐引用方式 GB/T 7714	Yang, Jing,Tao, Liming,Cao, Pengrui,et al. Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties[J]. MACROMOLECULAR MATERIALS AND ENGINEERING,2021,306(8).
APA	Yang, Jing.,Tao, Liming.,Cao, Pengrui.,Yang, Zenghui.,Zhang, Xinrui.,...&Zhang, Yaoming.(2021).Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties.MACROMOLECULAR MATERIALS AND ENGINEERING,306(8).
MLA	Yang, Jing,et al."Biphenyl Containing Shape Memory Epoxy Resin with Post-heating Adjustable Properties".MACROMOLECULAR MATERIALS AND ENGINEERING 306.8(2021).