Microstructure and thermal conductivity of Cu-B/diamond composites

doi:10.1177/0021998312460259

CORC > 兰州理工大学 > 兰州理工大学 > 省部共建有色金属先进加工与再利用国家重点实验室

	Microstructure and thermal conductivity of Cu-B/diamond composites
	Chu, Ke 1; Jia, Chengchang 2; Guo, Hong ; Li, Wensheng 1
刊名	JOURNAL OF COMPOSITE MATERIALS
	2013-10
卷号	47 期号:23 页码:2945-2953
关键词	Copper/diamond composites matrix alloying interface thermal conductivity
ISSN号	0021-9983
DOI	10.1177/0021998312460259
英文摘要	This article considers the potential of boron as matrix-alloying element and gives perspectives about which content of boron is favorable to maximize the interfacial bonding and thermal conductivity of copper/diamond composites. The thermal conductivity of Cu-B/diamond composites is investigated both experimentally and theoretically. The thermal conductivity measurements show that the optimum boron content at 0.8wt% has provided highest thermal conductivity of 538W/mK, increases 190% compared to that of copper/diamond composite without boron addition. Theoretical models are used to understand the underlying thermal conductivity enhancement mechanisms of matrix alloying. It is found that the Hasselman-Johnson model combined with a modified Debye model considering the carbide thermal resistance can provide a satisfactory agreement to the experimental data.
资助项目	National Natural Science Fund of China[50 971 020]
WOS研究方向	Materials Science
语种	英语
出版者	SAGE PUBLICATIONS LTD
WOS记录号	WOS:000329545100004
状态	已发表
内容类型	期刊论文
源URL	[http://119.78.100.223/handle/2XXMBERH/34619]
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
通讯作者	Chu, Ke
作者单位	1.Lanzhou Univ Technol, State Key Lab Gansu Adv Nonferrous Met Mat, Lanzhou 730050, Peoples R China 2.Univ Sci & Technol, Sch Mat Sci & Engn, Beijing, Peoples R China
推荐引用方式 GB/T 7714	Chu, Ke,Jia, Chengchang,Guo, Hong,et al. Microstructure and thermal conductivity of Cu-B/diamond composites[J]. JOURNAL OF COMPOSITE MATERIALS,2013,47(23):2945-2953.
APA	Chu, Ke,Jia, Chengchang,Guo, Hong,&Li, Wensheng.(2013).Microstructure and thermal conductivity of Cu-B/diamond composites.JOURNAL OF COMPOSITE MATERIALS,47(23),2945-2953.
MLA	Chu, Ke,et al."Microstructure and thermal conductivity of Cu-B/diamond composites".JOURNAL OF COMPOSITE MATERIALS 47.23(2013):2945-2953.