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Novel strip EAM with a ring resonator on InP/InGaAsP-MQW
Zhou, Zheng2; Cai, Chun1; Sun, Xiao-Han3
2011
关键词Electroabsorption modulators Etching Gallium compounds III-V semiconductors Indium phosphide Microwave resonators Optical communication Optical communication equipment Optical resonators Photonic integration technology Resonators Semiconducting indium phosphide 3D FDTD Electric absorption Environmental factors Functional devices Photonic microwave Substrate material Terminal equipment Time-domain methods
卷号4
DOI10.1109/CSAE.2011.5952898
页码502-506
英文摘要PIC chip refers to the one that has several functional devices based on the same substrate material, which has strong adaptability to environmental factors, such as vibration and temperature. The application of PIC chip in the node and terminal equipment of the optical communication can greatly enhance the equipment's ratio of performance over the price and reduce the volume. In this paper a three-dimension time domain method is employed as simulation instrument to design the strip EAM with a ring resonator on InP/InGaAsP-MQW, and the chip is produced by applying domestically advanced semi-conductor epitaxial growth and etching techniques, and it has passed the static test, which shows that the modulator has obvious electric absorption effects and the filtering peak of the resonator changes with the variation of offset voltage. © 2011 IEEE.
会议录Proceedings - 2011 IEEE International Conference on Computer Science and Automation Engineering, CSAE 2011
会议录出版者IEEE Computer Society
语种英语
内容类型会议论文
源URL[http://ir.lut.edu.cn/handle/2XXMBERH/116809]  
专题兰州理工大学
作者单位1.Shenzhen Academy of Metrology and Quality Inspection, Shenzhen, China;
2.Dept. Electrical Engineering, Lanzhou Polytechnic College, Lanzhou, China;
3.Research Laboratory of Photonics and Optical, Communication, Southeast University, Nanjing, China
推荐引用方式
GB/T 7714
Zhou, Zheng,Cai, Chun,Sun, Xiao-Han. Novel strip EAM with a ring resonator on InP/InGaAsP-MQW[C]. 见:.
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