Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder

doi:10.1021/acssuschemeng.0c03912

	Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder
	Yang, Shicong 1; Wan, Xiaohan 1; Wei, Kuixian 1,3; Ma, Wenhui 1,3,4; Wang, Zhi 2
刊名	ACS SUSTAINABLE CHEMISTRY & ENGINEERING
	2020-08-24
卷号	8 期号:33 页码:12577-12587
关键词	Diamond wire saw silicon powder Metallic impurities Occurrence state Dissolution mechanism Acid leaching process
ISSN号	2168-0485
DOI	10.1021/acssuschemeng.0c03912
英文摘要	The facilitation of metallic impurities removal via acid leaching pretreatment plays a key role in silicon recovery from diamond wire saw silicon powder (DWSSP) waste. Disappointingly, the occurrence state and dissolution mechanism of the metallic impurities present in DWSSP have not yet been revealed. For this reason, in this study, three different kinds of raw DWSSP were used for acid leaching tests and leaching behavior verification to investigate the dissolution mechanism. After two-stage acid leaching with 4 M HCl and 2 M HCl + 2.5 M HF, the results indicate that the removal efficiency was superior to that of other previously reported leaching processes. Furthermore, two occurrence states of metallic impurities present in DWSSP were defined based on their different dissolution behaviors, and the intrinsic relationship between dissolution behavior and the thinning process of the amorphous SiO2 shell was derived. The findings indicate that the first type of impurity was more easily dissolved in HCl solution; however, the second type of retained metallic impurity was restricted by the SiO2 shell barrier and was removed by the added HF solution. For this reason, the disintegration dissolution of the amorphous SiO2 shell was found to have a significant impact on the facilitation of the removal of impurities retained in DWSSP. The findings of this study are significant for the recovery of silicon from DWSSP with an effective acid leaching flow design.
资助项目	National Key R&D Program of China[2018YFC1901801] ; National Key R&D Program of China[2018YFC1901805] ; Major Science and Technology Projects in Yunnan Province[2019ZE007] ; Reserve Talents of Young and Middle-aged Academic and Technical Leaders in Yunnan Province[2018HB009] ; National Natural Science Foundation of China[51904134] ; Program for Innovative Research Team in University of Ministry of Education of China[IRT-17R48]
WOS关键词	KERF-LOSS SILICON ; HYDROGEN DESORPTION ; REMOVAL ; WASTE ; KINETICS ; SLURRY ; FABRICATION ; RECOVERY ; ALLOY ; BORON
WOS研究方向	Chemistry ; Science & Technology - Other Topics ; Engineering
语种	英语
出版者	AMER CHEMICAL SOC
WOS记录号	WOS:000563783100026
资助机构	National Key R&D Program of China ; Major Science and Technology Projects in Yunnan Province ; Reserve Talents of Young and Middle-aged Academic and Technical Leaders in Yunnan Province ; National Natural Science Foundation of China ; Program for Innovative Research Team in University of Ministry of Education of China
内容类型	期刊论文
源URL	[http://ir.ipe.ac.cn/handle/122111/41853]
专题	中国科学院过程工程研究所
通讯作者	Wei, Kuixian; Ma, Wenhui
作者单位	1.Kunming Univ Sci & Technol, Natl Engn Lab Vacuum Met, Fac Met & Energy Engn, Kunming 650093, Yunnan, Peoples R China 2.Chinese Acad Sci, Key Lab Green Proc & Engn, Inst Proc Engn, Natl Engn Lab Hydromet Cleaner Prod Technol, Beijing 100190, Peoples R China 3.Kunming Univ Sci & Technol, State Key Lab Complex Nonferrous Met Resources Cl, Kunming 650093, Yunnan, Peoples R China 4.Silicon Mat Ind Res Inst Innovat Ctr Yunnan Prov, Kunming 650093, Yunnan, Peoples R China
推荐引用方式 GB/T 7714	Yang, Shicong,Wan, Xiaohan,Wei, Kuixian,et al. Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder[J]. ACS SUSTAINABLE CHEMISTRY & ENGINEERING,2020,8(33):12577-12587.
APA	Yang, Shicong,Wan, Xiaohan,Wei, Kuixian,Ma, Wenhui,&Wang, Zhi.(2020).Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder.ACS SUSTAINABLE CHEMISTRY & ENGINEERING,8(33),12577-12587.
MLA	Yang, Shicong,et al."Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder".ACS SUSTAINABLE CHEMISTRY & ENGINEERING 8.33(2020):12577-12587.