The application of the scallop nanostructure in deep silicon etching

CORC > 生态环境研究中心 > 中国科学院生态环境研究中心 > 环境化学与生态毒理学国家重点实验室

	The application of the scallop nanostructure in deep silicon etching
	Lin, Yuanwei; Yuan, Renzhi; Zhou, Ce; Dong, Zihan; Su, Ziduo; Zhang, Haimiao; Chen, Zhenpeng; Li, Yunyun; Wang, Chun
刊名	NANOTECHNOLOGY
	2020-07-31
卷号	31 期号:31 页码:1-11
关键词	deep silicon etching Bosch process scallop nanostructure fluorocarbon polymer minimum effect
ISSN号	0957-4484
英文摘要	Micro/nanostructures with high aspect ratios in silicon wafers obtained by plasma etching are of great significance in device fabrication. In most cases, the scallop nanostructure in deep silicon etching should be suppressed. However, the scallop nanostructure could be applied in electronic device fabrication as characteristic information, which indicates the balance between deposition and etching. In this work, the applications of scallop nanostructures in etching process optimization and environmental protection are demonstrated. In addition, the minimum effect of the cycle time on the scallop size is reported for the first time. These results could bring new thoughts to the electronic devices related fields, such as micro-electro-mechanical systems (MEMS), silicon capacitors and advanced packaging.
内容类型	期刊论文
源URL	[http://ir.rcees.ac.cn/handle/311016/44820]
专题	生态环境研究中心_环境化学与生态毒理学国家重点实验室
推荐引用方式 GB/T 7714	Lin, Yuanwei,Yuan, Renzhi,Zhou, Ce,et al. The application of the scallop nanostructure in deep silicon etching[J]. NANOTECHNOLOGY,2020,31(31):1-11.
APA	Lin, Yuanwei.,Yuan, Renzhi.,Zhou, Ce.,Dong, Zihan.,Su, Ziduo.,...&Wang, Chun.(2020).The application of the scallop nanostructure in deep silicon etching.NANOTECHNOLOGY,31(31),1-11.
MLA	Lin, Yuanwei,et al."The application of the scallop nanostructure in deep silicon etching".NANOTECHNOLOGY 31.31(2020):1-11.