Inhibition Role of Trace Metal Ion Additives on Zinc Dendrites during Plating and Striping Processes

doi:10.1002/admi.201901358

CORC > 上海应用物理研究所 > 中国科学院上海应用物理研究所 > 中科院上海应用物理研究所2011-2017年

	Inhibition Role of Trace Metal Ion Additives on Zinc Dendrites during Plating and Striping Processes
	Chang, G ; Liu, SJ ; Fu, YN ; Hao, X ; Jin, W ; Ji, XB ; Hu, JG
刊名	ADVANCED MATERIALS INTERFACES
	2019
页码	-
关键词	HYDROGEN-PRODUCTION AIR BATTERIES ELECTRODEPOSITION ELECTROLYTES NANOPARTICLES LIQUID ALLOYS GROWTH ELECTROCHEMISTRY SUPPRESSION
ISSN号	2196-7350
DOI	10.1002/admi.201901358
文献子类	期刊论文
英文摘要	Dendritic inhibition is crucial for the cycle and reversibility of zinc-based batteries. In this work, the trace metal ions including lead, copper, and nickel are used as additives to inhibit the growth of zinc dendrites. The interfacial evolution behaviors of zinc deposits during plating and striping processes are in situ observed by synchrotron radiation X-ray imaging technique. The addition of lead and nickel ions induces a polarization role for zinc reduction, whereas copper ions present a depolarization role. After adding trace lead or nickel ions, zinc deposits become smoother and dendrites are effectively suppressed because of the homogenous deposition sites induced by co-deposition of lead or nickel. Due to the depolarization role of copper ions, a large number of bubbles generate on the substrate and the loose zinc dendrites adhere on the bubble surface. In addition, the zinc deposits in the presence of trace lead ions present a more homogeneous stripping behavior. These results are helpful for understanding the inhibition role of metal ions additives on zinc dendrites and potentially improve the reversibility of zinc-based batteries.
语种	英语
内容类型	期刊论文
源URL	[http://ir.sinap.ac.cn/handle/331007/32098]
专题	上海应用物理研究所_中科院上海应用物理研究所2011-2017年
作者单位	1.Cent S Univ, Coll Chem & Chem Engn, Changsha 410083, Hunan, Peoples R China; 2.Jiangnan Univ, Sch Chem & Mat Engn, Wuxi 214122, Jiangsu, Peoples R China; 3.Cent S Univ, Hunan Prov Key Lab Efficient & Clean Utilizat Man, Changsha 410083, Hunan, Peoples R China 4.Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai Synchrotron Radiat Facil, Shanghai 201204, Peoples R China;
推荐引用方式 GB/T 7714	Chang, G,Liu, SJ,Fu, YN,et al. Inhibition Role of Trace Metal Ion Additives on Zinc Dendrites during Plating and Striping Processes[J]. ADVANCED MATERIALS INTERFACES,2019:-.
APA	Chang, G.,Liu, SJ.,Fu, YN.,Hao, X.,Jin, W.,...&Hu, JG.(2019).Inhibition Role of Trace Metal Ion Additives on Zinc Dendrites during Plating and Striping Processes.ADVANCED MATERIALS INTERFACES,-.
MLA	Chang, G,et al."Inhibition Role of Trace Metal Ion Additives on Zinc Dendrites during Plating and Striping Processes".ADVANCED MATERIALS INTERFACES (2019):-.