Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''

doi:10.1109/ACCESS.2018.2888572

CORC > 宁波材料技术与工程研究所 > 中国科学院宁波材料技术与工程研究所 > 2019专题

	Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''
	Wang, Da-Wei ; Chen, Wenchao ; Zhao, Wen-Sheng ; Zhu, Guo-Dong ; Kang, Kai ; Gao, Pingqi ; Schutt-Aine, Jose E.; Yin, Wen-Yan
刊名	IEEE ACCESS
	2019
卷号	7 页码:3897-3908
关键词	RANDOM-ACCESS MEMORY RESISTIVE MEMORY INTEGRATION BEHAVIOR DIAMOND ZN4SB3 MODEL
DOI	10.1109/ACCESS.2018.2888572
英文摘要	Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''
内容类型	期刊论文
源URL	[http://ir.nimte.ac.cn/handle/174433/18820]
专题	2019专题
作者单位	1.Zhao, WS (reprint author), Hangzhou Dianzi Univ, Sch Elect & Informat, Hangzhou 310018, Zhejiang, Peoples R China. 2.Chen, WC (reprint author), Zhejiang Univ, ZJU LTIUC Inst, Int Campus, Haining 314400, Peoples R China. 3.Yin, WY (reprint author), Zhejiang Univ, Innovat Inst Electromagnet Informat & Elect Integ, Coll Informat Sci & Elect Engn, Key Lab Adv Micronano Elect Devices & Smart Syst, Hangzhou 310058, Zhejiang, Peoples R China. 4.Chen, WC
推荐引用方式 GB/T 7714	Wang, Da-Wei,Chen, Wenchao,Zhao, Wen-Sheng,et al. Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''[J]. IEEE ACCESS,2019,7:3897-3908.
APA	Wang, Da-Wei.,Chen, Wenchao.,Zhao, Wen-Sheng.,Zhu, Guo-Dong.,Kang, Kai.,...&Yin, Wen-Yan.(2019).Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''.IEEE ACCESS,7,3897-3908.
MLA	Wang, Da-Wei,et al."Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the "Thermal-House''".IEEE ACCESS 7(2019):3897-3908.