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	Multibeam semiconductor laser device
	TAKAMURA TAKASHI
	1990-10-18
著作权人	SEIKO EPSON CORP
专利号	JP1990257690A
国家	日本
文献子类	发明申请
其他题名	Multibeam semiconductor laser device
英文摘要	PURPOSE:To improve reliability, and to simplify a process by bonding conductive material wirings in number corresponding to the number of laser beams fitted onto a sub-mount and the electrode of a multibeam semiconductor laser element by a conductive wax material. CONSTITUTION:Gold is vacuum-deposited onto a cubic system boron nitride substrate (a sub-mount) 101, and leading-out electrodes (conductive material wirings) 102 are formed through a photolithographic process. The conductive material wirings 102 in number corresponding to the number of laser beams are shaped onto the sub-mount 101 at that time. The electrodes 105 of a multibeam semiconductor laser element 103 and the conductive material wirings 102 are die-bonded with indium used as a wax material, and lastly wire bonding is executed by a gold wire 104. Accordingly, high reliability is acquired, and a process is simplified.
公开日期	1990-10-18
申请日期	1989-03-30
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/79206]
专题	半导体激光器专利数据库
作者单位	SEIKO EPSON CORP
推荐引用方式 GB/T 7714	TAKAMURA TAKASHI. Multibeam semiconductor laser device. JP1990257690A. 1990-10-18.

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