Multibeam semiconductor laser device
SHIMADA KATSUTO
1988-06-13
著作权人SEIKO EPSON CORP
专利号JP1988141385A
国家日本
文献子类发明申请
其他题名Multibeam semiconductor laser device
英文摘要PURPOSE:To improve the property of heat radiation by gluing a base stand equipped with the paired number of a conductive material interconnection for laser beam and a multibeam semiconductor laser element on a heat sink through soldering materials with a junction-down method. CONSTITUTION:After conductive materials for outgoing electrodes such as Au form a film on a single crystal sapphire (Al2O3) heat sink 101 with a spatter process, its film is treated by patterning with an ordinary photolighographic process and then, the outgoing electrodes 103 are formed into a based stand. Further, a multibeam semiconductor laser element 104 is glued through a soldering material with a junction-down method and a common electrode as well as the outgoing electrode 103 are treated by bonding with gold wires 105 and then, the interconnection of respective electrodes is formed.
公开日期1988-06-13
申请日期1986-12-04
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/70739]  
专题半导体激光器专利数据库
作者单位SEIKO EPSON CORP
推荐引用方式
GB/T 7714
SHIMADA KATSUTO. Multibeam semiconductor laser device. JP1988141385A. 1988-06-13.
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