Multiple laser system packaging | |
RICKMAN, ANDREW GEORGE; ABEDIASL, HOOMAN | |
2019-02-21 | |
著作权人 | ROCKLEY PHOTONICS LIMITED |
专利号 | WO2019034771A1 |
国家 | 世界知识产权组织 |
文献子类 | 发明申请 |
其他题名 | Multiple laser system packaging |
英文摘要 | A photonic chip comprising tunable lasers, emitters and other optical components such as waveguides, wavelength band combiners and wavelength lockers, is packaged with one or more complementary metal-oxide semiconductor chips in different ways. The complementary metal-oxide semiconductor chips are arranged on the sides or the bottom of the photonic chip. Through-Si-vias or wire bonding provides electrical contact between the photonic chip and the complementary metal-oxide semiconductor chips. |
公开日期 | 2019-02-21 |
申请日期 | 2018-08-17 |
状态 | 未确认 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/57732] |
专题 | 半导体激光器专利数据库 |
作者单位 | ROCKLEY PHOTONICS LIMITED |
推荐引用方式 GB/T 7714 | RICKMAN, ANDREW GEORGE,ABEDIASL, HOOMAN. Multiple laser system packaging. WO2019034771A1. 2019-02-21. |
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