QQ客服 官方微博 反馈留言

	Light emitting diodes and methods with encapsulation
	HUSSELL, CHRISTOPHER P.; ZHENYU, ZHONG
	2016-10-06
著作权人	CREE, INC.
专利号	US20160293811A1
国家	美国
文献子类	发明申请
其他题名	Light emitting diodes and methods with encapsulation
英文摘要	Solid state lighting apparatuses, systems, and related methods are provided. An example apparatus can include one or more light emitting diodes (LEDs) and a dark or black encapsulation layer surrounding and/or disposed between the one or more LEDs. The apparatus can include, e.g., a substrate or a leadframe for mounting the LEDs. A method for producing a panel of LEDs can include joining the LEDs to the panel, e.g., by bump bonding, and flooding the panel with dark or black encapsulation material so that the LED chips are surrounded by the dark or black encapsulation material.
公开日期	2016-10-06
申请日期	2016-03-31
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54681]
专题	半导体激光器专利数据库
作者单位	CREE, INC.
推荐引用方式 GB/T 7714	HUSSELL, CHRISTOPHER P.,ZHENYU, ZHONG. Light emitting diodes and methods with encapsulation. US20160293811A1. 2016-10-06.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。