Light-emitting element and method of manufacturing the same
SHINOHARA, HIRONAO
2015-12-03
著作权人TOYODA GOSEI CO., LTD.
专利号US20150349226A1
国家美国
文献子类发明申请
其他题名Light-emitting element and method of manufacturing the same
英文摘要A light-emitting element includes a bonding pad for connecting a bonding wire, and a coating film covering upper and side surfaces of the bonding pad. The coating film includes a mixture material including Au and one metal of Ta, Ti, Pt, Mo, Ni and W. A method of manufacturing a light-emitting element includes simultaneously sputtering Au and one metal of Ta, Ti, Pt, Mo, Ni and W on upper and side surfaces of a bonding pad by using the Au and the metal as a sputtering target so as to form thereon a coating film including a mixture material including Au and the metal.
公开日期2015-12-03
申请日期2015-05-28
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/54588]  
专题半导体激光器专利数据库
作者单位TOYODA GOSEI CO., LTD.
推荐引用方式
GB/T 7714
SHINOHARA, HIRONAO. Light-emitting element and method of manufacturing the same. US20150349226A1. 2015-12-03.
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