Light-emitting element and method of manufacturing the same | |
SHINOHARA, HIRONAO | |
2015-12-03 | |
著作权人 | TOYODA GOSEI CO., LTD. |
专利号 | US20150349226A1 |
国家 | 美国 |
文献子类 | 发明申请 |
其他题名 | Light-emitting element and method of manufacturing the same |
英文摘要 | A light-emitting element includes a bonding pad for connecting a bonding wire, and a coating film covering upper and side surfaces of the bonding pad. The coating film includes a mixture material including Au and one metal of Ta, Ti, Pt, Mo, Ni and W. A method of manufacturing a light-emitting element includes simultaneously sputtering Au and one metal of Ta, Ti, Pt, Mo, Ni and W on upper and side surfaces of a bonding pad by using the Au and the metal as a sputtering target so as to form thereon a coating film including a mixture material including Au and the metal. |
公开日期 | 2015-12-03 |
申请日期 | 2015-05-28 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/54588] |
专题 | 半导体激光器专利数据库 |
作者单位 | TOYODA GOSEI CO., LTD. |
推荐引用方式 GB/T 7714 | SHINOHARA, HIRONAO. Light-emitting element and method of manufacturing the same. US20150349226A1. 2015-12-03. |
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