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	Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
	LEE, YOUNG-JIN; LEE, JEONG-WOOK; MOON, KYUNG-MI; SONG, YOUNG-HEE; CHOI, III-HEUNG
	2011-11-10
著作权人	SAMSUNG ELECTRONICS CO., LTD.
专利号	US20110272716A1
国家	美国
文献子类	发明申请
其他题名	Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module
英文摘要	A lead frame for a chip package, a chip package, a package module, and an illumination apparatus including the chip package module. The chip package includes a first coupling portion and a second coupling portion that are coupled to each other on edges of a lead frame for mounting a chip thereon, and thus a package module is easily embodied by coupling the first coupling portion and the second coupling portion to each other.
公开日期	2011-11-10
申请日期	2011-05-06
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54234]
专题	半导体激光器专利数据库
作者单位	SAMSUNG ELECTRONICS CO., LTD.
推荐引用方式 GB/T 7714	LEE, YOUNG-JIN,LEE, JEONG-WOOK,MOON, KYUNG-MI,et al. Lead frame for chip package, chip package, package module, and illumination apparatus including chip package module. US20110272716A1. 2011-11-10.

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