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	Conduction cooled package laser and packaging method for forming the same
	OU, SZUTSUN SIMON; HSIAO, PO-WEN; HSIEH, CHIA-HUNG; YANG, HUI-PING; HSU, YING-FENG
	2012-04-05
著作权人	ARIMA LASERS CORP.
专利号	US20120082176A1
国家	美国
文献子类	发明申请
其他题名	Conduction cooled package laser and packaging method for forming the same
英文摘要	A packaging method for forming a conduction cooled package (CCP) laser is provided and includes soldering a semiconductor laser device on the first heat spreader; and then bonding the first heat spreader on the second spreader via an Al/Ni nano-laminated foil. Moreover, a CCP laser is also provided herein.
公开日期	2012-04-05
申请日期	2011-03-28
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54221]
专题	半导体激光器专利数据库
作者单位	ARIMA LASERS CORP.
推荐引用方式 GB/T 7714	OU, SZUTSUN SIMON,HSIAO, PO-WEN,HSIEH, CHIA-HUNG,et al. Conduction cooled package laser and packaging method for forming the same. US20120082176A1. 2012-04-05.

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