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	Clad metal substrates in optical packages
	BHAGAVATULA, VENKATA ADISESHAIAH; CHAPARALA, SATISH CHANDRA; HIMMELREICH, JOHN; HUGHES, JR., LAWRENCE CHARLES
	2011-06-02
著作权人	CORNING INCORPORATED
专利号	US20110129189A1
国家	美国
文献子类	发明申请
其他题名	Clad metal substrates in optical packages
英文摘要	Embodiments of the present disclosure bring a wavelength conversion device into close proximity with a laser source to eliminate the need for coupling optics, reduce the number of package components, and reduce package volume. According to one embodiment of the present disclosure, an optical package is provided comprising a laser diode chip and a clad metal substrate. The clad metal substrate comprises a clad metal region that is mechanically coupled to a base metal region. The laser diode chip is coupled to the clad metal region. The clad metal region comprises a clad metal material having a thermal conductivity that is greater than a thermal conductivity of the base metal material. The clad metal region further comprises a coefficient of thermal expansion that is approximately equal to a coefficient of thermal expansion of the base metal material and is greater than a coefficient of thermal expansion of the laser diode chip.
公开日期	2011-06-02
申请日期	2009-11-30
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54123]
专题	半导体激光器专利数据库
作者单位	CORNING INCORPORATED
推荐引用方式 GB/T 7714	BHAGAVATULA, VENKATA ADISESHAIAH,CHAPARALA, SATISH CHANDRA,HIMMELREICH, JOHN,et al. Clad metal substrates in optical packages. US20110129189A1. 2011-06-02.

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