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	LED device and method for manufacturing the same
	IWASAKI, KAZUYUKI; SUZUKI, FUSAO
	2006-05-25
著作权人	STANLEY ELECTRIC CO., LTD.
专利号	US20060108594A1
国家	美国
文献子类	发明申请
其他题名	LED device and method for manufacturing the same
英文摘要	An LED device can include LED chips mounted with high density and encapsulated with a resin. The device may not be substantially affected by fluctuations in thermal stress generated in the encapsulating resin and can have reduced fluctuations in characteristics such as output power and a color tone and can have a high level of reliability which can be maintained over a long period of time. The LED device can be manufactured by a method that includes mounting LED chips with high density on a metal stem having conductive-material-made leads that extend from the metal stem, welding a lens holder having a lens temporarily fixed thereto by a silicone resin to the stem so as to enclose the LED chips, and encapsulating the LED chips and bonding wires by injecting a silicone resin serving as an encapsulating resin having translucency and flexibility into a space defined by the stem, the holder, and the lens.
公开日期	2006-05-25
申请日期	2005-11-09
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53746]
专题	半导体激光器专利数据库
作者单位	STANLEY ELECTRIC CO., LTD.
推荐引用方式 GB/T 7714	IWASAKI, KAZUYUKI,SUZUKI, FUSAO. LED device and method for manufacturing the same. US20060108594A1. 2006-05-25.

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