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	Cooling of electronics by electrically conducting fluids; Cooling of electronics by electrically conducting fluids
	GHOSHAL, UTTAM; MINER, ANDREW CARL
	2005-07-14 ; 2005-07-14
著作权人	NANOCOOLERS, INC. ; NANOCOOLERS, INC.
专利号	AU2003299624A1 ; AU2003299624A1
国家	澳大利亚 ; 澳大利亚
文献子类	发明申请 ; 发明申请
其他题名	Cooling of electronics by electrically conducting fluids ; Cooling of electronics by electrically conducting fluids
英文摘要	A system to provide effective removal of heat from a high power density device. The system has a heat spreader [501] and a heat sink [505] structure. The heat spreader [601] is divided into one [507] or more chambers. [605], [607], [609] and [611].Electromagnetic pumps [615], [617] placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chambers. The liquid metal preferable is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area over the high power density device [503] and distributes it over the entire spreader [601]. This results in a uniform distribution of heat on the base of the heat sink [505] structure and hence effective removal of heat by the heat sink [505] structure.; A system to provide effective removal of heat from a high power density device. The system has a heat spreader [501] and a heat sink [505] structure. The heat spreader [601] is divided into one [507] or more chambers. [605], [607], [609] and [611].Electromagnetic pumps [615], [617] placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chambers. The liquid metal preferable is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area over the high power density device [503] and distributes it over the entire spreader [601]. This results in a uniform distribution of heat on the base of the heat sink [505] structure and hence effective removal of heat by the heat sink [505] structure.
公开日期	2005-07-14 ; 2005-07-14
申请日期	2003-12-15 ; 2003-12-15
状态	失效 ; 失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53208]
专题	半导体激光器专利数据库
作者单位	NANOCOOLERS, INC.
推荐引用方式 GB/T 7714	GHOSHAL, UTTAM,MINER, ANDREW CARL. Cooling of electronics by electrically conducting fluids, Cooling of electronics by electrically conducting fluids. AU2003299624A1, AU2003299624A1. 2005-07-14, 2005-07-14.

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