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	Package structure with a retarding structure and method of making same
	HUANG, CHEN-TUNG; TU, JIM-TREN; YOU, HSANG-HSING; LU, HUANG-AN; CHANG, MING-LAN; LEE, TAI-YING
	2005-05-05
著作权人	TAI-SAW TECHNOLOGY CO., LTD.
专利号	US20050093178A1
国家	美国
文献子类	发明申请
其他题名	Package structure with a retarding structure and method of making same
英文摘要	An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.
公开日期	2005-05-05
申请日期	2003-11-04
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53176]
专题	半导体激光器专利数据库
作者单位	TAI-SAW TECHNOLOGY CO., LTD.
推荐引用方式 GB/T 7714	HUANG, CHEN-TUNG,TU, JIM-TREN,YOU, HSANG-HSING,et al. Package structure with a retarding structure and method of making same. US20050093178A1. 2005-05-05.

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